/ PUR hot melt adhesive

PUR hot melt adhesive

Publish Time:2026-05-26 Source: Bont Electronics

Screen bezel and structural part bonding—PUR

Bondte's polyurethane reactive hot melt adhesives combine strength and toughness, and are commonly used for bonding smart electronic product screens, structural parts, and component assembly. They perform excellently in reliability tests such as impact resistance, chemical corrosion resistance, high-temperature and high-humidity resistance, and thermal shock resistance. We have developed a series of new products for specific applications. For smartphone camera module applications, our products offer excellent toughness, sealing performance, and good reliability; for narrow-bezel LCM side-edge sealing of mobile phones, our products feature good flowability, fast curing speed, and high light-shielding efficiency.

If you have higher requirements for a particular product performance, we will develop customized solutions based on your needs.

 

Product Model ?Outstanding Performance Typical Applications
BE-1108 ·Extremely high initial strength
·High curing efficiency
·Suitable for bonding various substrates
·Good toughness, excellent impact resistance test performance
·Excellent durability and reliability
·Chemical corrosion resistance
·Good thermal stability in the molten state
·Compliant with RoHS, halogen-free, and Reach?? environmental testing requirements
·Customized development available based on customer needs
Smartphone punch-hole screen camera module bonding
BE-1106 ·One-component moisture curing
·High light-shielding efficiency, prevents light leakage
·Excellent bonding strength and toughness
·Good flowability, thinner adhesive layer
·Excellent durability and reliability
·Chemical corrosion resistance
·Compliant with RoHS, halogen-free, and Reach environmental testing requirements
·Customized development available for light transmittance, etc.
Mobile phone narrow-bezel LCM side-edge sealing
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