Single-component addition-curing sealant

Key Features：

It combines heat resistance and weather resistance with the flexibility and adhesion of organic materials; the curing process produces no by-products, shrinkage is extremely low, and the material assumes an elastomeric state upon curing, enabling it to operate stably over the long term within a temperature range of –60 °C to 280 °C; Compared with traditional condensation-curing sealants, addition-curing sealants offer superior resistance to high and low temperatures, electrical insulation and ageing resistance; furthermore, they do not release volatile substances, making them environmentally and human-friendly.

The curing rate is significantly affected by temperature; heating can accelerate curing, whilst it can also cure slowly at room temperature. The curing process is not affected by ambient humidity.

✅ Electronics and Electrical Appliances Sector

• Used for bonding and securing electronic components, as well as for sealing and moisture protection, such as positioning capacitors, resistors and sensors, to prevent components from becoming dislodged due to vibration or short-circuiting due to moisture ingress;
• As a potting compound for LED luminaires, it protects the LED chips and the driver circuit, whilst also providing good thermal conductivity to aid heat dissipation;
• Used for sealing in semiconductor equipment, such as the encapsulation of chips and wafers, it offers excellent electrical insulation and resistance to ageing.

✅ The new energy vehicle sector

• For thermal bonding of IGBT/SiC modules in power battery packs, motor controllers and on-board chargers,