/ Two-component addition-cure potting compound

Two-component addition-cure potting compound

Two-component addition-cure potting adhesive is a silicone potting material composed of two liquid components, A and B, which cure after being mixed in proportion.

Product Description

Core Features:

It combines excellent weather resistance, insulation, and the shock-absorbing and damping properties of elastomers; the curing process releases no low-molecular-weight by-products and has extremely low shrinkage, enabling deep vulcanization; the elastomer formed after curing has a wide range of thermal conductivity and can operate stably over the long term within a broad temperature range of -60℃ to 280℃.

The curing speed is significantly affected by temperature. At room temperature, complete curing usually takes 6–24 hours, and heating can accelerate curing.

Typical Application Scenarios

? Electronics and Electrical Appliance Industry

Used for potting protection of high-heat-source devices such as HID lamp module power supplies and LED driver power supplies.
Potting power electronic components such as transformers, reactors, and inverters to improve insulation performance and shock resistance, and extend equipment service life.

? New Energy Vehicle Sector

Used for potting battery management system (BMS) circuit boards to protect electronic components from vibration, moisture, and corrosion, ensuring stable operation of the battery system.
As a potting material for motor controllers and on-board chargers (OBC), it adapts to complex working environments with high temperatures and vibration, ensuring reliable heat dissipation for power components.

? Electronic Components

Potting precision electronic components such as sensors and transmitters to provide waterproof, dustproof, and shock-resistant protection, improving equipment reliability in harsh environments.

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Two-component condensation-type potting adhesive

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