充电机及车载大功率模块用双组份加成型高导热灌封胶

用于汽车充电机的导热灌封,也可用于车载大功率模块及电子元器件的导热灌封保护

车载充电机(OBC)的所有电子器件需要被封装密闭的壳体环境中以防止环境的污染。要求这些发热量巨大的电子器件/芯片/MOSFET等必须与五金铸模的壳体内壁接触,以有效地实现热传递(散热)。

灌封胶的高导热率可改善热传导,可以填补器件和散热体表面不平整的空气间隙,元器件产生的热负荷与五金铸模的壳体内壁有充分接触并实现热传递,同时有机硅弹性体低应力有效保护电子元件,同时具有防水、电气绝缘性能。

 

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