Two-component addition-curing, high-thermal-conductivity potting compound for chargers and high-power on-board modules

14 July 2026
1.36 am

Thermal potting for automotive chargers; may also be used for thermal potting protection of high-power modules and electronic components in vehicles

All electronic components within an on-board charger (OBC) must be enclosed within a sealed housing to prevent environmental contamination. These components—which generate a significant amount of heat, such as electronic components, chips and MOSFETs—must be in contact with the inner wall of the die-cast metal housing to ensure effective heat transfer (heat dissipation).

The high thermal conductivity of the potting compound improves heat transfer; it fills air gaps caused by surface irregularities between components and heat sinks, ensuring that the heat generated by the components comes into full contact with the inner walls of the metal die-cast housing to facilitate heat transfer. At the same time, the low-stress silicone elastomer effectively protects electronic components whilst providing waterproofing and electrical insulation.

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