Two-component addition-curing potting compound for control modules and sensors

14 July 2026
1.39 am

Used to protect various automotive electronic control modules, including the engine control module, HID headlight module, windscreen wiper controller, power supply system module, powertrain module, braking system module, exhaust emission control module, lighting system, various sensors, connectors and other components.

Features: Possesses good adhesive properties and excellent dielectric properties; provides protection against dust and water ingress; prevents solder joints from coming loose; offers adequate insulation protection; meets basic requirements for resistance to thermal shock, moisture, contamination and corrosion; whilst also providing a degree of heat dissipation. Once cured, the product exhibits excellent elasticity, meeting the requirements of electrical appliances for shock and impact resistance. It has a very low shrinkage rate during curing, does not produce low-molecular-weight compounds during the curing process, and cures rapidly when heated.

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