Key Features：
It combines the dual functions of bonding and high-efficiency thermal conductivity; once cured, it forms an elastomer capable of stable operation across a wide temperature range of –60 °C to 280 °C, whilst also offering excellent electrical insulation, weather resistance and resistance to vibration and impact.
Typical Use Cases
✅ The new energy vehicle sector
- Used for the thermal bonding of IGBT/SiC modules in power battery packs, motor controllers and on-board chargers, it ensures stable heat dissipation from power components in complex environments characterised by high temperatures and vibration.
✅ Consumer electronics sector
- Used between the CPU/GPU and the heat dissipation substrate in smartphones and laptops, it fills the gaps at the interface through bonding, thereby improving thermal conductivity and contributing to the trend towards smaller, higher-performance electronic devices.
- Used for heat dissipation in chips for wearable devices such as smartwatches and fitness trackers; its low-volatility properties prevent volatile substances from contaminating the internal precision sensors, thereby ensuring measurement accuracy.
✅ Industrial and telecommunications applications
- Provides thermal bonding for power modules in industrial variable-frequency drives and server power supplies, enabling long-term operation in high-temperature environments and reducing equipment maintenance costs.
✅ Security and outdoor equipment
- Designed for heat dissipation in outdoor security surveillance cameras, this chip maintains its elasticity and thermal conductivity across a wide temperature range of -40°C to 60°C. Its low oil migration properties prevent oil contamination of the lens, ensuring high-quality night-time imaging.
