Two-component condensation-curing encapsulant

Condensation type

This refers to its curing mechanism. During the curing process, small molecules such as ethanol and acetone are released, resulting in slight shrinkage and a slight odour.

Key Features

During the curing process, it “releases” small molecules. This stands in stark contrast to “addition-cure” silicones, which do not release any substances during curing, and is a key distinguishing factor when choosing between the two. It offers excellent adhesion, bonding firmly to metals and most plastics without the need for a primer. It also exhibits strong resistance to poisoning, is unlikely to degrade upon contact with substances such as sulphur or amines, and has a high tolerance to temperature and humidity. It cures at room temperature and achieves rapid deep-penetration curing;

 TypicalUse Cases

✅ Power supply industry:LED drivers, switching power supplies and adaptors are potted, ensuring a secure bond between the components and the housing.

✅ Automotive Electronics:Ignition coils, regulators, sensors and the like; the operating environment is complex, yet the requirements for resistance to poisoning are high.

✅ General electronic components:Insulation protection for connectors, relays and coils.

✅ The new energy sector: Charging points, photovoltaic junction boxes, etc.