电机、逆变器、IGBT、ECU及控制器壳体用结构胶

用于电机、逆变器、IGBT、ECU、PTC及各类车载控制器的外壳密封粘接,替代传统密封圈。可用于CIPG、FIPG工艺

特点:加温固化,耐温优异,粘接各种材质,特别是对金属粘接性非常好,气味低,不含二甲苯,甲苯,满足VOC要求,耐侯性佳,防潮、抗震、防紫外线、防水,不会因恶劣的天气环境而改变其性能,主要用于电机、逆变器、PTC及耐高温要求的器件粘接固定,也 用于各类控制器壳体粘接密封。

 

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Positioning itself in the new energy sector, Bonte’s innovative adhesive materials are driving the industry’s green transition

Against the backdrop of the ‘Dual Carbon’ policy, the new energy industry is entering a period of rapid development, with the pace of technological iteration continuing to accelerate for products such as power batteries, energy storage equipment and new energy support components. As new energy equipment is subjected to working environments characterised by alternating high and low temperatures, high vibration and heavy loads over extended periods, this places extremely high demands on adhesives in terms of bonding strength, resistance to high and low temperatures, insulation and protection, waterproof sealing, flame retardancy and environmental friendliness. High-performance, safe and eco-friendly adhesive materials have thus become a crucial safeguard for the safe development of the new energy industry.

With over twenty years’ experience in the adhesives sector, Bonte leverages its global R&D capabilities to drive high-end manufacturing.

At a time when high-end manufacturing sectors such as microelectronics, displays and new energy are undergoing rapid upgrading, adhesives are no longer merely auxiliary consumables, but rather key core materials that determine a product’s stability, precision and durability. The iterative upgrading of high-end manufacturing is driving adhesive materials to achieve continuous breakthroughs in terms of high precision, high compatibility, environmental friendliness and high stability. Materials companies possessing core R&D capabilities and proven industry experience are becoming vital pillars of the supply chain’s upgrading, with Bonte serving as a prime example.

Empowering Precision Manufacturing: Bonte Adhesives Help the Microelectronics Industry Improve Quality and Efficiency

With the rapid development of 5G, artificial intelligence and the smart device industry, microelectronic devices are continuously evolving towards miniaturisation, high precision, high integration and high reliability. The manufacture of core components such as chips, micro-components and precision circuit boards places the most exacting demands on adhesives in terms of bonding precision, insulation properties, high-temperature resistance and stability; even the slightest deviation in materials can directly affect the performance and service life of end products. Consequently, high-end specialised adhesives have become a critical and essential material for the upgrading of the microelectronics industry.