Used for sealing and bonding the housings of motors, inverters, IGBTs, ECUs, PTCs and various types of on-board controllers, replacing traditional sealing rings. Suitable for CIPG and FIPG processes.
Features: Heat-curing; excellent temperature resistance; bonds a wide range of materials, with particularly good adhesion to metals; low odour; free from xylene and toluene; complies with VOC requirements; excellent weather resistance; moisture-resistant, shock-resistant, UV-resistant and waterproof; its performance remains unaffected by adverse weather conditions. Primarily used for bonding and securing motors, inverters, PTCs and components requiring high-temperature resistance, it is also used for bonding and sealing the housings of various controllers.
