Low-stress encapsulation silicone gel

14 July 2026
1.35 am

Low-stress potting for control modules such as IGBTs, ECUs and BSGs in electric vehicles.

Features: 1. Once cured, the gel exhibits good adhesion and sealing performance on many substrates, and offers excellent resistance to thermal cycling, heat and mechanical shock; 2. The gel retains most of the stress-relief and self-healing properties of the liquid, whilst maintaining the dimensional stability of the elastomer, thereby achieving relatively ideal impact resistance and vibration damping effects; 3, The raw materials are purified using proprietary technology and are characterised by non-corrosiveness and low molecular content; 4. The two-component mixture does not gel rapidly upon mixing, providing a suitable working time; however, it cures rapidly once heated. The curing time can be freely controlled, and no by-products are generated during curing, nor does the material shrink; 5. It possesses excellent electrical insulation properties, such as high dielectric strength and volume resistivity, and is resistant to salt spray corrosion and damp heat.

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