双组份环氧结构胶

主要用于小型电子元器件的粘接固定等,其良好的触变性对于加固工程具有优势,具有良好的施工性能,易搅拌,易涂抹,不流坠;对于一些立面或仰面作业时,一般的结构胶往往收到重力作业从构件流出,不仅污染了基材表面,也造成了料体的浪费;该产品的结构胶在涂抹于材料表面时由于触变性能保证胶体不流坠,固化后具有良好的粘接强度。

 

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Positioning itself in the new energy sector, Bonte’s innovative adhesive materials are driving the industry’s green transition

Against the backdrop of the ‘Dual Carbon’ policy, the new energy industry is entering a period of rapid development, with the pace of technological iteration continuing to accelerate for products such as power batteries, energy storage equipment and new energy support components. As new energy equipment is subjected to working environments characterised by alternating high and low temperatures, high vibration and heavy loads over extended periods, this places extremely high demands on adhesives in terms of bonding strength, resistance to high and low temperatures, insulation and protection, waterproof sealing, flame retardancy and environmental friendliness. High-performance, safe and eco-friendly adhesive materials have thus become a crucial safeguard for the safe development of the new energy industry.

With over twenty years’ experience in the adhesives sector, Bonte leverages its global R&D capabilities to drive high-end manufacturing.

At a time when high-end manufacturing sectors such as microelectronics, displays and new energy are undergoing rapid upgrading, adhesives are no longer merely auxiliary consumables, but rather key core materials that determine a product’s stability, precision and durability. The iterative upgrading of high-end manufacturing is driving adhesive materials to achieve continuous breakthroughs in terms of high precision, high compatibility, environmental friendliness and high stability. Materials companies possessing core R&D capabilities and proven industry experience are becoming vital pillars of the supply chain’s upgrading, with Bonte serving as a prime example.

Empowering Precision Manufacturing: Bonte Adhesives Help the Microelectronics Industry Improve Quality and Efficiency

With the rapid development of 5G, artificial intelligence and the smart device industry, microelectronic devices are continuously evolving towards miniaturisation, high precision, high integration and high reliability. The manufacture of core components such as chips, micro-components and precision circuit boards places the most exacting demands on adhesives in terms of bonding precision, insulation properties, high-temperature resistance and stability; even the slightest deviation in materials can directly affect the performance and service life of end products. Consequently, high-end specialised adhesives have become a critical and essential material for the upgrading of the microelectronics industry.