Primarily used for bonding and securing small electronic components, its excellent thixotropic properties offer advantages for reinforcement projects; it has good workability, is easy to mix and apply, and does not sag; When working on vertical or overhead surfaces, standard structural adhesives often run off the components due to gravity, not only contaminating the substrate surface but also resulting in wastage of the material; when applied to a surface, this structural adhesive’s thixotropic properties ensure it does not sag, and it develops excellent bond strength once cured.
