线路板三防涂覆

用于汽车电子线路板的三防涂覆

因汽车行驶的环境恶劣,为了防止各种潮气和霉菌侵害电路板,因此在电路板上刷上一层保护三防漆,完全固化后就可以产生一层保护膜,以达到防潮防水防腐蚀防盐雾的效果。

特点:单组份,可直接选用喷漆或刷涂 浸涂。低气味,具有突岀的防潮性能,由于有机硅氧烷具有良好的介电性能,耐电弧、耐电火花、电击穿强度高,以及具有良好的防水性能,在潮湿环境下漆膜仍具有良好的耐电性能。具有绝缘漆的耐热性和优于一般涂料耐低温性能。耐化学药品性能良好,有较强的耐氧化性,具有良 好的热稳定性、抗老化性等性,具有良好的热稳定性、抗老化性等。

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Positioning itself in the new energy sector, Bonte’s innovative adhesive materials are driving the industry’s green transition

Against the backdrop of the ‘Dual Carbon’ policy, the new energy industry is entering a period of rapid development, with the pace of technological iteration continuing to accelerate for products such as power batteries, energy storage equipment and new energy support components. As new energy equipment is subjected to working environments characterised by alternating high and low temperatures, high vibration and heavy loads over extended periods, this places extremely high demands on adhesives in terms of bonding strength, resistance to high and low temperatures, insulation and protection, waterproof sealing, flame retardancy and environmental friendliness. High-performance, safe and eco-friendly adhesive materials have thus become a crucial safeguard for the safe development of the new energy industry.

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At a time when high-end manufacturing sectors such as microelectronics, displays and new energy are undergoing rapid upgrading, adhesives are no longer merely auxiliary consumables, but rather key core materials that determine a product’s stability, precision and durability. The iterative upgrading of high-end manufacturing is driving adhesive materials to achieve continuous breakthroughs in terms of high precision, high compatibility, environmental friendliness and high stability. Materials companies possessing core R&D capabilities and proven industry experience are becoming vital pillars of the supply chain’s upgrading, with Bonte serving as a prime example.

Empowering Precision Manufacturing: Bonte Adhesives Help the Microelectronics Industry Improve Quality and Efficiency

With the rapid development of 5G, artificial intelligence and the smart device industry, microelectronic devices are continuously evolving towards miniaturisation, high precision, high integration and high reliability. The manufacture of core components such as chips, micro-components and precision circuit boards places the most exacting demands on adhesives in terms of bonding precision, insulation properties, high-temperature resistance and stability; even the slightest deviation in materials can directly affect the performance and service life of end products. Consequently, high-end specialised adhesives have become a critical and essential material for the upgrading of the microelectronics industry.