车载多媒体显示屏、触摸屏柔性电路板(FPC)密封

用于车载多媒体显示屏、触摸屏柔性电路板(FPC)密封。

产品粘接强度高、内应力低、抗振动,通过双85及盐雾测试,抗冷热冲击、耐高低温循环,低卤素、环保型低挥发,与FPC上的元器件、聚酰亚胺PI面具有良好的粘接作用,也可用于各种触控芯片IC的焊接部位补强、加固、抗振动、防焊点氧化的胶水,产品快速固化。

 

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Positioning itself in the new energy sector, Bonte’s innovative adhesive materials are driving the industry’s green transition

Against the backdrop of the ‘Dual Carbon’ policy, the new energy industry is entering a period of rapid development, with the pace of technological iteration continuing to accelerate for products such as power batteries, energy storage equipment and new energy support components. As new energy equipment is subjected to working environments characterised by alternating high and low temperatures, high vibration and heavy loads over extended periods, this places extremely high demands on adhesives in terms of bonding strength, resistance to high and low temperatures, insulation and protection, waterproof sealing, flame retardancy and environmental friendliness. High-performance, safe and eco-friendly adhesive materials have thus become a crucial safeguard for the safe development of the new energy industry.

With over twenty years’ experience in the adhesives sector, Bonte leverages its global R&D capabilities to drive high-end manufacturing.

At a time when high-end manufacturing sectors such as microelectronics, displays and new energy are undergoing rapid upgrading, adhesives are no longer merely auxiliary consumables, but rather key core materials that determine a product’s stability, precision and durability. The iterative upgrading of high-end manufacturing is driving adhesive materials to achieve continuous breakthroughs in terms of high precision, high compatibility, environmental friendliness and high stability. Materials companies possessing core R&D capabilities and proven industry experience are becoming vital pillars of the supply chain’s upgrading, with Bonte serving as a prime example.

Empowering Precision Manufacturing: Bonte Adhesives Help the Microelectronics Industry Improve Quality and Efficiency

With the rapid development of 5G, artificial intelligence and the smart device industry, microelectronic devices are continuously evolving towards miniaturisation, high precision, high integration and high reliability. The manufacture of core components such as chips, micro-components and precision circuit boards places the most exacting demands on adhesives in terms of bonding precision, insulation properties, high-temperature resistance and stability; even the slightest deviation in materials can directly affect the performance and service life of end products. Consequently, high-end specialised adhesives have become a critical and essential material for the upgrading of the microelectronics industry.