PUR hot-melt adhesive

Bonding of Screen Bezel to Structural Components — PUR

Bonte’s polyurethane reactive hot-melt adhesives combine strength with toughness and are commonly used for bonding screens in smart electronic devices, as well as for bonding structural components and assembling parts. They demonstrate excellent performance in reliability tests, including resistance to impact, chemical corrosion, high temperatures and humidity, and thermal shock. We have developed a range of new products tailored to specific applications. For smartphone camera module applications, our products offer outstanding toughness, sealing performance and excellent reliability; for side sealing of narrow-bezel LCMs in mobile phones, our products feature good flow properties, rapid curing and high light-blocking efficiency.

Should you have specific requirements regarding a particular feature of the product, we will undertake bespoke development tailored to your needs.

 

Product model  Outstanding performance Typical Applications
BE-1108 · Extremely high initial strength
· High curing efficiency
· Suitable for bonding a wide range of substrates
· Good toughness, with excellent performance in impact tests
· Excellent durability and reliability
· Resistance to chemical corrosion
· Good thermal stability in the molten state
· Complies with RoHS, halogen-free and REACH environmental testing requirements
· Customised development can be provided to meet client requirements
Bonding of camera modules for smartphone punch-hole displays
BE-1106 · Single-component moisture-curing
· High light-blocking efficiency, preventing light from penetrating
· Excellent adhesive strength and toughness
· Good fluidity, thinner adhesive layer
· Excellent durability and reliability
· Resistance to chemical corrosion
· Complies with environmental testing requirements such as RoHS, halogen-free and REACH
· Can be customised and developed to meet specific requirements, such as light transmittance
Side sealing of LCMs for mobile phones with narrow bezels

Related information

Positioning itself in the new energy sector, Bonte’s innovative adhesive materials are driving the industry’s green transition

Against the backdrop of the ‘Dual Carbon’ policy, the new energy industry is entering a period of rapid development, with the pace of technological iteration continuing to accelerate for products such as power batteries, energy storage equipment and new energy support components. As new energy equipment is subjected to working environments characterised by alternating high and low temperatures, high vibration and heavy loads over extended periods, this places extremely high demands on adhesives in terms of bonding strength, resistance to high and low temperatures, insulation and protection, waterproof sealing, flame retardancy and environmental friendliness. High-performance, safe and eco-friendly adhesive materials have thus become a crucial safeguard for the safe development of the new energy industry.

With over twenty years’ experience in the adhesives sector, Bonte leverages its global R&D capabilities to drive high-end manufacturing.

At a time when high-end manufacturing sectors such as microelectronics, displays and new energy are undergoing rapid upgrading, adhesives are no longer merely auxiliary consumables, but rather key core materials that determine a product’s stability, precision and durability. The iterative upgrading of high-end manufacturing is driving adhesive materials to achieve continuous breakthroughs in terms of high precision, high compatibility, environmental friendliness and high stability. Materials companies possessing core R&D capabilities and proven industry experience are becoming vital pillars of the supply chain’s upgrading, with Bonte serving as a prime example.

Empowering Precision Manufacturing: Bonte Adhesives Help the Microelectronics Industry Improve Quality and Efficiency

With the rapid development of 5G, artificial intelligence and the smart device industry, microelectronic devices are continuously evolving towards miniaturisation, high precision, high integration and high reliability. The manufacture of core components such as chips, micro-components and precision circuit boards places the most exacting demands on adhesives in terms of bonding precision, insulation properties, high-temperature resistance and stability; even the slightest deviation in materials can directly affect the performance and service life of end products. Consequently, high-end specialised adhesives have become a critical and essential material for the upgrading of the microelectronics industry.