低应力灌封硅凝胶

用于电动汽车IGBT、ECU、BSG等控制模块的低应力灌封。

特点:1、凝胶固化后对许多基材的粘附性和密封性能良好,具有极优的抗冷热交变性能、热量和机械冲击,2、凝胶保留了液体的大部分应力释放及自愈合特性,又保持了弹性体的尺寸稳定性,能够达到比较理想的抗冲击、减震效果, 3、原料通过专有技术进行提纯,具有无腐蚀性、低分子含量等特点,4、两组份混合后不会快速凝胶,有合适的操作时间,一旦加热就会很快固化, 固化时间可以自由控制,固化过程中无副产物产生,无收缩,5、具有高介电强度和体积电阻率等优异的电气绝缘性能,耐盐雾腐蚀和耐湿热。

 

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