Sealing of flexible printed circuit boards (FPCs) for in-vehicle multimedia displays and touchscreens
For sealing flexible printed circuit boards (FPCs) used in in-vehicle multimedia displays and touchscreens.
The product offers high bonding strength, low internal stress and vibration resistance; it has passed dual 85°C/85% RH and salt spray tests, and is resistant to thermal shock and capable of withstanding high and low temperature cycling. It is low-halogen, environmentally friendly and low-volatile, and adheres well to components on FPCs and polyimide (PI) surfaces. It can also be used to reinforce, strengthen, provide vibration resistance and prevent solder joint oxidation at the solder joints of various touch control ICs. The product cures rapidly.
Transparent potting for in-vehicle multimedia displays, LED displays and control modules
For in-vehicle multimedia displays, LED displays and other control modules. Transparent potting compound. Features: Single-component, no mixing required, easy to use; thickness controlled to within 6 mm […]
Adhesive sealing of sensors such as reversing sensors, smart Bluetooth door locks and buzzers
Used for the insulated, shock-resistant sealing of various in-vehicle sensors, such as reversing sensors, buzzers and tyre pressure sensors.
Features: Single-component, easy to use, offering excellent bonding, fixing, sealing, electrical, insulating, moisture-proof, shock-absorbing and ageing-resistant properties; provides good adhesion to most metal, plastic and alloy substrates; resistant to thermal shock at both high and low temperatures, with low internal stress and good crack-resistance.
Encapsulation of sensors such as reversing sensors, smart Bluetooth door locks and buzzers
Used for insulating, shock-absorbing and sealing various in-vehicle sensors, such as reversing sensors, buzzers, Bluetooth RF components (e.g. Bluetooth sensors in door handles, Bluetooth antennas, etc.), electronic accelerator pedals and tyre pressure sensors.
The product offers moderate strength, good elasticity, and excellent properties in terms of adhesion, fastening, sealing, electrical insulation, moisture resistance, shock resistance and ageing resistance; It is chemically stable and exhibits good weather resistance, heat resistance and cold resistance; it adheres well to most metal, plastic and alloy substrates, and demonstrates strong adhesion to the majority of materials. It offers excellent resistance to high and low-temperature impact, has low internal stress and good crack-resistance.
High-temperature-resistant potting compound for PTC heaters
For insulating potting of PTC electric heaters or other high-temperature-resistant power modules.
The product bonds exceptionally well to PTC metal casings, maintains good strength under prolonged high-temperature conditions, and produces no by-products and minimal odour when cured at high temperatures.
Two-component addition-curing potting compound for control modules and sensors
Used to protect various automotive electronic control modules, including the engine control module, HID headlight module, windscreen wiper controller, power supply system module, powertrain module, braking system module, exhaust emission control module, lighting system, various sensors, connectors and other components.
Sealant for automotive airbags
Provides excellent adhesive performance, such as peel strength and cohesive failure, when sealing joints or seams between two pieces of fabric. The first and second pieces are bonded together and then sewn with one or more stitches to provide sufficient mechanical strength. The seam is stitched using a silicone adhesive to ensure sufficient airtightness or pressure retention when the airbag deploys.
Thermal conductive gel inherits the advantages of silicone materials, such as good compatibility, weather resistance, resistance to high and low temperatures, and excellent insulation properties. At the same time, it is highly malleable, enabling it to fill uneven interfaces and meet heat transfer requirements across a wide range of applications.
Compared with thermal pads, thermal gels are softer and have better surface affinity; they can be compressed to a very low thickness, significantly improving heat transfer efficiency, and can be compressed to as little as 0.1 mm, at which point the thermal resistance ranges from 0.08 °C·in²/W to 0.3 °C·in²/W, matching the performance of some thermal greases. Furthermore, thermal conductive gel has virtually no hardness and does not induce internal stress in equipment after use. Compared to thermal conductive pads, it adheres more easily to the mating surfaces; compared to thermal grease, it provides a better seal and is less prone to powdering.
Heat-conducting gel for thermal modules
Used for heat transfer between the battery pack and the water-cooled plate; engine control unit, transmission control unit, fuel pump control unit, ABS anti-lock braking system, VSC vehicle stability […]
Two-component addition-curing, high-thermal-conductivity potting compound for chargers and high-power on-board modules
Thermal potting for automotive chargers; may also be used for thermal potting protection of high-power modules and electronic components in vehicles
All electronic components within an on-board charger (OBC) must be enclosed within a sealed housing to prevent environmental contamination. These components—which generate a significant amount of heat, such as electronic components, chips and MOSFETs—must be in contact with the inner wall of the die-cast metal housing to ensure effective heat transfer (heat dissipation).
The high thermal conductivity of the potting compound improves heat transfer; it fills air gaps caused by surface irregularities between components and heat sinks, ensuring that the heat generated by the components comes into full contact with the inner walls of the metal die-cast housing to facilitate heat transfer. At the same time, the low-stress silicone elastomer effectively protects electronic components whilst providing waterproofing and electrical insulation.
Low-stress encapsulation silicone gel
Low-stress potting for control modules such as IGBTs, ECUs and BSGs in electric vehicles.
Features: 1. Once cured, the gel exhibits good adhesion and sealing performance on many substrates, and offers excellent resistance to thermal cycling, heat and mechanical shock; 2. The gel retains most of the stress-relief and self-healing properties of the liquid, whilst maintaining the dimensional stability of the elastomer, thereby achieving relatively ideal impact resistance and vibration damping effects; 3, The raw materials are purified using proprietary technology and are characterised by non-corrosiveness and low molecular content; 4. The two-component mixture does not gel rapidly upon mixing, providing a suitable working time; however, it cures rapidly once heated. The curing time can be freely controlled, and no by-products are generated during curing, nor does the material shrink; 5. It possesses excellent electrical insulation properties, such as high dielectric strength and volume resistivity, and is resistant to salt spray corrosion and damp heat.
Structural adhesives for motor, inverter, IGBT, ECU and controller housings
Used for sealing and bonding the housings of motors, inverters, IGBTs, ECUs, PTCs and various types of on-board controllers, replacing traditional sealing rings. Suitable for CIPG and FIPG processes.
Features: Heat-curing; excellent temperature resistance; bonds a wide range of materials, with particularly good adhesion to metals; low odour; free from xylene and toluene; complies with VOC requirements; excellent weather resistance; moisture-resistant, shock-resistant, UV-resistant and waterproof; its performance remains unaffected by adverse weather conditions. Primarily used for bonding and securing motors, inverters, PTCs and components requiring high-temperature resistance, it is also used for bonding and sealing the housings of various controllers.
High-thermal-conductivity bonding adhesive for automotive power devices
For electronic control systems (MCU, BMS, VCU, etc.) and their components and circuit boards; OBC systems; charging points; power battery pack cells; DC/DC converters […]
Adhesive for securing automotive electronic components
Used to bond and secure electronic components in vehicles, preventing them from becoming dislodged and failing whilst the vehicle is being driven over bumpy roads
Characteristics: A single-component, alcohol-evaporating type, offering resistance to tensile stress, vibration and impact, as well as excellent weather resistance, heat resistance, cold resistance and hydrophobicity. The product is characterised by low volatility, low molecular content and non-corrosiveness, and adheres well to a wide range of substrates.
Protection of chip pins, IC pins and solder joints on integrated circuit boards
For sealing and protecting chip pins, IC pins and PCB solder joints
Features: The product is non-corrosive, with controlled low ion and low molecular content; it cures rapidly at room temperature and exhibits a semi-thixotropic, semi-flowing consistency. After application, the adhesive spreads to encapsulate the pin solder joints without running. It is used to encapsulate the area around integrated circuit (IC) pins to protect the chip and provide reinforcement, thereby enhancing its shock-absorbing properties. It is also used to seal solder joints, preventing oxidation, and offers resistance to salt spray, damp heat and corrosion. The product is characterised by low ion content, low corrosion, low volatility and high purity, and is used for sealing applications requiring high heat resistance and high strength.
Bonding of metal body panels using structural adhesives
Used for bonding metal body structures, AB adhesive bonding—unlike traditional welding processes—does not require high-temperature heating, does not cause metal deformation, and also reduces […]
