For sealing and protecting chip pins, IC pins and PCB solder joints
Features: The product is non-corrosive, with controlled low ion and low molecular content; it cures rapidly at room temperature and exhibits a semi-thixotropic, semi-flowing consistency. After application, the adhesive spreads to encapsulate the pin solder joints without running. It is used to encapsulate the area around integrated circuit (IC) pins to protect the chip and provide reinforcement, thereby enhancing its shock-absorbing properties. It is also used to seal solder joints, preventing oxidation, and offers resistance to salt spray, damp heat and corrosion. The product is characterised by low ion content, low corrosion, low volatility and high purity, and is used for sealing applications requiring high heat resistance and high strength.
